 |
| Laser writer for photomask fabrication |
 |
| Sputter deposition system |
 |
| MCM-D on silicon for flip-chip mounted dies on a BGA package |
Photomask fabrication
Using a laser writer, DWL 400 from Heidelberg Instruments, we have in-house fabrication of standard size, hard surface chrome photomasks. We supply photomasks for e.g. microelectronic industry, MEMS, opto electronic and medical applications.
Customers include all from multinational companies to small R&D laboratories. All customers get personel service and short delivery time. GDSII data is preferred, but other formats are not excluded. We can also assist with layout work.
Contact us about this.
More about Photomask fabrication.
Large area processing
To develop and demonstrate low cost high density MCM-D substrate manufacturing technology for 1st level die assembly, Acreo has invested in process equipment for panel sizes up to 24" × 24". Equipment for the following processes are available.
| Metal deposition |
Lithography |
| Spin coating |
Develop/Etch |
More about Large area processing.
MCM-D substrate processing technology
The necessary thin film technology for electronic packaging encompasses physical and wet chemical metal deposition, etching and polymer/metal multilayer technologies. The main process line in the facility is capable of handling wafers and other substrates up to 150 mm in size.
| Vacuum deposition |
Lithography |
|
Spin coating |
Profiling |
| Diceing |
Inspection |
| Heat treatment |
Wet etching |
| Characterization |
Dry etching |
More about MCM-D substrate processing technology.
Printing Laboratory
We develop processes and materials for printing of displays and electronics on flexible substrates in a reel-to-reel production unit.
More about Printing Laboratory.