Analytical services
/ In Swedish: Analysservice /
- Fast and effective failure analysis of electronic systems, active and passive components.
- Identification of the root cause of the problem.
- Recommendations for action and complyment actions suggested in the final report.
We have access to top modern analytical instruments and are supported by academic experts at The Royal Institute of Technology (KTH) and at Angstoms Laboratory (Uppsala University).
- SEM and TEM evaluations of microstructures, analysis of defects and material composition.
- Debugging of new IC designs.
- FIB /focused ion beam/ Creation of new MIM components without the need of photolithographic masks.
- FIB cross sectioning of structures with submicron precision.
- FIB editing an existing IC design
- EMMI Emission microscopy locates damaged components, finds leak-currents of uA magnitude, analyses current distribution of high power components, locates latch-up, verifies functions and supports failure analysis of ICs on application board.
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| Reverse side emission image |
Front side emission image |
- Electric failure localisation and verification by curve tracer – EMMI – FIB
- Analysis of electromechanical and metallurgic failures.
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| Purple plague |
Broken bond wire |
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| Inspection and documentation |
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Microelectronics Quality Service
Contact:
Imre Kéri, project manager
Mob:+46 730 755 313
Tel:+46 8 632 7734
imre.keri@acreo.se
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