MCM-D substrate processing technology

Heat treatment

Vacuum deposition systems
MRC Sputter

Diceing
Wafersaw

Spin coating equipment
Characterization Characterisation

Profiling

Wet etching
Lithography Wet etching
Dry etching
Inspection

2004-03-11	Characterization
	Electrical and optical

2004-03-11	Heat treatment
	Ovens

2004-03-11	Diceing
	Wafersaw

2004-03-11	Vacuum deposition systems
	Several systems available

2004-03-11	Spin coating equipment
	A number of systems available

Links for Interconnect & Packaging Lab:

Lab Resources Overview

	Large Area Processing Process equipment
	MCM-D substrate processing technology Overview
	Photomask fabrication Direct Write Lithography Systems
	Printing Laboratory for manual screen-printing, plotting and UV curing