2009-04-21
The Zarlink Optical Product group is continuing the long tradition of manufacturing optoelectronic devices, that was originated by HAFO some 50 years ago. Products have covered single and array devices in the infrared region for space, industrial and commercial use. Today’s focus is on 850 nm devices for high speed optical data communication.
A paradigm shift: From copper cables to active optical cables
There is a paradigm shift ongoing just in front of us regarding technology for high speed short reach interconnect. The ever increasing need for internet bandwidth has driven data storage, server halls and computer clusters to finally face the change from copper based short reach cables to optical short reach communication. The shift occurs when data rates around 5-10 Gbit/s are needed, where copper cables finally have to give in. Copper is now challenged by low cost AOC’s, Active Optical Cables. These cables have an electrical interface at each end, but have an internal laser-fiber-detector function built into the cable. A copper cable can be directly replaced by an AOC.
At Zarlink we were very early to develop and produce the industry’s first generation of AOC for the short reach market. However, the challenge of competing with copper technology is very tough. There is a high demand on the VCSEL-fiber-PIN performance, with low jitter, and good reliability. Apart from this, the cost has to be driven down by a factor of 3-5 compared to previous typical high end optical module technology. So, how is this possible to achieve?
Enter IMAGIC
We are constantly seeking the very best assembly methods and building practices for combining optical devices with driver and detector electronics and fiber attach. Within IMAGIC we all face the great need of efficiently assembling and connecting the electronics to our imaging detectors or transmitters, irrespective of our different products. New techniques enabling low cost, large volume production is a must. It is here that we find it important to work with IMAGIC, where new optoelectronic building concepts can be developed and tested outside of our own capabilities. With current market input expressed by the members, together with innovation, we all have the possibility to reach relevant new low cost assembly solutions for our next generation optoelectronic and imaging products.
Ivar Hamberg
Fab Manager
Zarlink Optical Products Group