The thin film HDI activities at Acreo started in 1986, and since then we have gained a great competence through missions ranging from big R/D projects to small scale production.
Our basic competencies come from experience and knowledge about materials and processes for manufacturing of thin film substrates. We also have a great competence in physical and electrical characterization of the substrates through various measurements.
A specific and somewhat unique competence is the manufacturing of substrates for RF applications. Others are the ability to process HDI substrates on large area panels, combine technologies (MCM-L/D & MCM-D/C), make thin film devices based on organic materials, and make optical wave guides.
The key lab resources are process equipment for 4"-6" wafer processing and 24" x 24" panel processing (LAP) accompanied by a variation of characterization tools.
(Simple address to this page: www.acreo.se/HDI)