HDI - Services
Acreo offers services, either using existing substrate processes, or developing and adapting processes for specific applications. We can provide design, prototyping and (small scale) production.
In our process lab wafer diameters of 100, 125, and 150 mm can be handled. In addition to chip carriers (MCM-D substrates), we can process interconnect and resistor networks on active wafers with ICs.
We also have capability of large area processing (LAP), of panel size up to 609.6 x 609.6 mm2 (24 x 24 inch). See more about our LAP facilities.
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